Light emitting diode and light emitting diode device including the light emitting diode element and method for manufacturing the light emitting diode

ABSTRACT

A light emitting diode has a base made of heat conductive material, a wire plate made of an insulation material and secured to an upper surface of the base. Conductive patterns are secured to the wire plate, and a light emitting diode element is secured to the base at an exposed mounting area. The light emitting diode element is electrically connected to the conductive patterns.

This application is a division of Ser. No. 10/784,242 filed Feb. 24,2004.

BACKGROUND OF THE INVENTION

The present invention relates to a high luminance light emitting diode(LED) including an LED element, and to a method for manufacturing theLED, and more particularly to the LED which is improved in heatradiation thereof. The LED element of compound semiconductor is widelyused because of long life and small size. Further, the LED element ofGaN semiconductor which emits blue light has been produced, and the LEDincluding this kind of LED element is used in color display devices alsoin a small color backlight system of the portable telephone and in anautomotive display, and the utilization field of the LED is furtherexpanded as an illumination device having a high luminance and highpower.

In recent years, various LEDs of the surface mount type are producedbecause of mass productivity and miniaturization of the LEDs. However,when those kind of LEDs are operated at high luminance and high power,there is a problem of heat radiation. Namely, if the driving current isincreased in order to increase the luminance, the loss of electric powerincreases in proportion to the increase of driving current, and most ofelectric energy is transformed into heat, thereby increasing the heat ofthe LED to high temperature. The light emitting efficiency(current-light transformation efficiency) of the LED decreases as thetemperature of the LED is elevated. Further, the life of the LED elementbecomes short, and the transparency of the resin covering the LEDelement decreases because of color change thereof at high temperature,which causes the reliability of the LED to reduce.

In order to resolve these problems, various heat radiation means havebeen proposed. As one of the means, an LED is proposed, wherein a pairof conductive members made of heat conductive metal are secured to aninsulation member, and an LED element is mounted on the conductivemembers. Japanese Patent Application Laid Open 11-307820 discloses thiskind of LED.

FIG. 16 is a perspective view showing the conventional LED.

The LED 1 comprises a pair of conductive members 2 a and 2 b made ofmetal having high thermal conductivity, an insulation member 3 made ofresin for insulating the conductive members 2 a and 2 b and combiningthe members. The insulation member 3 has an opening 3 a having anelongated circular shape. A part of each of the conductive members 2 a,2 b is exposed in the opening. An LED element 4 is secured to exposedparts of the conductive members 2 a, 2 b, so that the LED element 4 iselectrically and thermally connected to conductive members 2 a and 2 b.The LED element 4 is encapsulated by a transparent sealing member 5.

The LED 1 is mounted on a print substrate 6, and the conductive members2 a and 2 b are connected to a pair of conductive patterns 6 a and 6 bby solders. When driving current is applied to the LED element 4 fromthe patterns 6 a and 6 b through conductive members 2 a and 2 b, the LEDelement 4 emits light. Heat generated in the LED element 4 by power lossis transmitted to the print substrate 6 through the conductive members 2a and 2 b, so that the heat is efficiently radiated from the printsubstrate 6 if the substrate is made of a material having high thermalconductivity.

Another conventional heat radiation means is disclosed in JapanesePatent Application Laid Open 2002-252373. In the means, a base formounting an LED element and lead frames as terminal electrodes are madeof same material, the base and the lead frames are positioned at thesame level, and the base is directly mounted on a substrate.

FIG. 17 is a sectional view showing the conventional LED. The LED 10comprises a base 11 and a pair of lead frames 12 a and 12 b which aremade of same conductive material and securely mounted on a printsubstrate 16 by solders 17, so that the base 11 and lead frames 12 a, 12b are positioned at the same level, and are thermally combined with eachother. An LED element 13 is mounted on the bottom of the base 11,thereby to be thermally combined with the base 11.

The anode and cathode of the LED element 13 are electrically connectedto the lead frames 12 a, 12 b by lead wires 14 a and 14 b. A transparentresin 15 encapsulates the LED element 13, lead frames 12 a, 12 b andwires 14 a, 14 b. When driving current is applied to the LED element 13from the print substrate 16 through lead frames 12 a and 12 b, the LEDelement 13 emits light. Heat generated in the LED element 13 by powerloss is transmitted to the print substrate 16 through the base 11, sothat the heat is efficiently radiated from the print substrate 16 if thesubstrate is made of a material having high thermal conductivity.

As another means, there is proposed that through holes are formed in theprint substrate 16 by conductive patterns, and heat radiation membersare disposed on the underside of the print substrate, so that heat istransmitted to the heat radiation members.

In the LED shown in FIG. 16, if the print substrate 6 is made of amaterial having high thermal conductivity such as a metal coresubstrate, heat radiation effect is expectable.

However, the print substrate 6 is generally made of cheap material suchas an epoxy resin having low thermal conductivity. Namely, the thermalconductivity of the epoxy resin is one several hundredth of copper alloyas the material of the metal core substrate. Therefore, the heat is notsufficiently transmitted to the print substrate, thereby raising thetemperature of the LED element, and reducing the quality thereof.

However, metal core can not be used because of high manufacturing cost.Furthermore, there is a problem that since it is difficult to wire onboth sides of metal core substrate, high density mounting is impossible.In addition, it is necessary to insulate the surface of the metal coresubstrate by providing an insulation layer on the substrate since themetal core is conductive material. However, the insulation layer reducesthe thermal conductivity to decrease the heat radiation effect.

The LED 10 of FIG. 17 also has the same problems as the LED of FIG. 16.Since the base 11 is directly adhered to the print substrate 16, thethermal conductivity from the base to the print substrate 16 must beeffective. However, if the print substrate 16 is made of epoxy resin,heat radiation effect can not be expected. Further, if the conductivethrough holes are provided between the base 11 and the heat radiationmembers secured to the underside of the print substrate 16, heatconnection there-between is not so effective, and hence great heatradiation improvement can not be achieved.

SUMMARY OF THE INVENTION

An object of the present invention is to provide an LED having anexcellent heat radiation characteristic.

Another object is to provide a high luminance LED using a printsubstrate for mounting the high luminance LED element, the printsubstrate of which is not limited in material.

According to the present invention, there is provided an LED comprisinga base made of heat conductive material and having a heat radiationsurface formed on a surface thereof, at least one wire plate made of aninsulation material and secured to an upper surface of the base,exposing means for forming an exposed mounting area on the surface ofthe base, conductive patterns formed on the wire plate, an LED elementsecured to the base at the mounting area, and connecting means forelectrically connecting the LED element to the conductive patterns.

The exposing means is a perforated hole formed in the wire plate, andthe connecting means comprises a plurality of lead wires.

An encapsulating member is provided for protecting the LED element.

Cooling fins are provided on the heat radiation surface of the base forincreasing heat radiation effect. An LED is further provided.

The LED comprises a base made of heat conductive material and having aflat plate shape and a heat radiation surface formed on a surfacethereof, at least one wire plate made of an insulation material andsecured to an upper surface of the base, exposing means for forming anexposed mounting area on the surface of the base, conductive patternssecured to the wire plate, an LED element secured to the base at themounting area, connecting means for electrically connecting the LEDelement to the conductive patterns, a print substrate having conductivepatterns provided on an underside thereof and secured to the conductivepatterns on the wire plate so as to electrically connect both theconductive patterns.

The print substrate has a hole for discharging the light emitted fromthe LED element, and a heat radiating member is secured to an undersideof the base.

Another LED comprises a base made of heat conductive material and havinga flat plate shape and a heat radiation surface formed on a surfacethereof, at least one wire plate made of an insulation material andsecured to an upper surface of the base, exposing means for forming anexposed mounting area on the surface of the base, conductive patternssecured to the wire plate, an LED element secured to the base at themounting area, connecting means for electrically connecting the LEDelement to the conductive patterns, heat pipes projected from a sidewall of the base, and a heat radiation member secured to ends of theheat pipes.

Another LED has a plurality of LED elements, each of the LED elementscomprising a base made of heat conductive material and having a flatplate shape and a heat radiation surface formed on a surface thereof, atleast one wire plate made of an insulation material and secured to anupper surface of the base, exposing means for forming an exposedmounting area on the surface of the base, conductive patterns secured tothe wire plate, an LED element secured to the base at the mounting area,connecting means for electrically connecting the LED element to theconductive patterns, wherein the LED has a heat radiation member made ofa flexible material, and the LED elements are supported on a surface ofthe heat radiation member.

The present invention further provides a method for manufacturing LEDscomprising the steps of preparing a wire plate aggregation having aplurality of divisions, and preparing a base aggregation having a samesize as the wire plate aggregation, forming a mounting hole in eachdivision of the wire plate aggregation, and providing a plurality ofconductive patterns on each division, securing the wire plateaggregation and the base aggregation with each other, mounting an LEDelement on the wire plate aggregation at the mounting hole, electricallyconnecting the LED element with the conductive patterns by wires,encapsulating the LED element and wires by encapsulating member, anddicing the aggregation of the LEDs.

These and other objects and features of the present invention willbecome more apparent from the following detailed description withreference to the accompanying drawings.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a perspective view of a high luminance LED according to afirst embodiment of the present invention;

FIG. 2 is a sectional view taken along a line II-II of FIG. 1;

FIG. 3 is a perspective view of a high luminance LED according to asecond embodiment of the present invention;

FIG. 4 is a perspective view of a high luminance LED according to athird embodiment of the present invention;

FIG. 5 is a perspective view of a high luminance LED according to afourth embodiment of the present invention;

FIG. 6 is a sectional view taken along a line VI VI of FIG. 5;

FIG. 7 is a sectional view of an LED according to a fifth embodiment ofthe present invention;

FIG. 8 is a perspective view showing a sixth embodiment of the presentinvention;

FIG. 9 is a side view showing a seventh embodiment of the presentinvention;

FIG. 10 is a perspective view showing a wire plate aggregation and abase aggregation;

FIG. 11 is a perspective view showing a combination step of the wireplate aggregation and the base aggregation;

FIG. 12 is a perspective view showing a mounting step of an LED;

FIG. 13 is a perspective view showing a wire bonding step;

FIG. 14 is a perspective view showing an encapsulating step;

FIG. 15 is a perspective view showing a dicing step;

FIG. 16 is a perspective view showing a conventional LED; and

FIG. 17 is a sectional view showing a conventional LED.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

FIG. 1 is a perspective view of a high luminance LED according to afirst embodiment of the present invention, FIG. 2 is a sectional viewtaken along a line II-II of FIG. 1.

The high luminance LED 20 comprises a base 21 having a rectangularparallelepiped and made of a metal core material of copper alloy havinghigh thermal conductivity, and a wire plate 22 secured to the uppersurface of the base by adhesives 22 a opposite an underside heatradiation surface 21 a. The wire plate is prepreg and has an insulationquality.

A pair of conductive patterns 23 and 24 are formed on the wire plate 22by copper foil. The conductive patterns 23 and 24 have terminal portions23 a, 23 b, 24 a and 24 b at respective corners as connecting surfaces.The terminal portions 23 a, 23 b, 24 a and 24 b are disposed oppositethe heat radiation surface 21 a of the base 21, interposing the wireplate 22 and the base 21.

A mounting opening 22 b having a circular shape is formed in the wireplate 22 to expose a mounting area 21 c of the upper surface of the base21. An LED element 25 is mounted on the mounting area 21 c and securedto the area by a silver paste 25 a having thermal conductivity. Thus,the LED element 25 is thermally connected to the base 21 through thesilver paste 25 a.

A pair of anodes and a pair of cathodes (not shown) are electricallyconnected to the conductive patterns 23, 24 by four lead wires 26 a, 26b, 26 c and 26 d. In order to realize a high luminance LED, a largedriving current is necessary. To this end, it is preferable to apply ahigh current to the anodes and cathodes of the LED element by two wiresrespectively. The LED element 25, lead wires 26 a 26 d and a part of thewire plate 22 are encapsulated by an encapsulating member 27 to protectthese members.

When driving voltage is applied to the conductive patterns 23 and 24,the voltage is applied to the LED element 25 through the wires 26 a 26d. Thus, the LED element 25 is driven to consume the power to generateenergy. A part of the energy becomes light which is discharged passingthrough the encapsulating member 27, and a large part of the energybecomes heat which is discharged from the LED element. The heat of theLED element is transmitted to the base 21 having excellent thermalconductivity through the silver paste 25 a. Thus, the heat isefficiently transmitted to the base 21.

If a heat radiation member having a large heat capacity is adhered tothe heat radiation surface 21 a of the underside of the base 21, theheat of the base 21 is transferred to the heat radiation member, therebyrealizing efficient heat radiation.

In this embodiment, although one LED element is provided, the base 21 ismade into an elongated plate, a plurality of LED elements may be mountedon the base. Furthermore, a plurality of wire plates 22 may be securedto the upper surface of the base 21 so as to form the mounting area 21c.

FIG. 3 is a perspective view of a high luminance LED according to asecond embodiment of the present invention.

The same parts as the first embodiment are identified by the samereference numerals as those of FIGS. 1 and 2.

The high luminance LED element 30 has a base 31 having a rectangularparallelepiped and made of a metal core material of copper alloy havinghigh thermal conductivity.

A wire plate 22 is secured to the upper surface of the base 31 byadhesives. Since the wire plate 22, LED element 25 and encapsulatingmember 27 are the same as the first embodiment, explanation thereof isomitted hereinafter.

There is formed a plurality of parallel cooling fins 31 a on theunderside of the base 31 to increase the heat radiation area.

When the driving voltage is applied to the LED element 25, the LEDelement 25 is driven to consume the power to generate energy. A part ofthe energy becomes light which is discharged passing through the member27, and a large part of the energy becomes heat which is discharged fromthe LED element. The heat of the LED element is effectively transmittedto the base 31. Since there is provided a plurality of cooling fins 31 aon the underside of the base 31, the heat is effectively radiated tocool the LED element 25. If there is provided a cooling fan to cool theLED element 25, the heat radiation is more effectively performed. Thecooling fins may be formed on side walls of the base 31.

FIG. 4 is a perspective view of a high luminance LED according to athird embodiment of the present invention.

The same parts as the first embodiment are identified by the samereference numerals as those of FIGS. 1 and 2, and explanation thereof isomitted.

The high luminance LED 40 has a base 41 having a rectangularparallelepiped and made of a metal core material of copper alloy havinghigh thermal conductivity.

There is formed a plurality of heat radiation cylindrical holes 41 a inone of sides of the base 41 in parallel with the underside of the base.It is preferable that the hole 41 a is perforated. If a heat conductivematerial is inserted in the hole, the heat radiation effect increases.

FIG. 5 is a perspective view of a high luminance LED according to afourth embodiment of the present invention, and FIG. 6 is a sectionalview taken along a line VI VI of FIG. 5.

The same parts as the first embodiment are identified by the samereference numerals as those of FIGS. 1 and 2, and explanation about apart thereof is omitted.

The high luminance LED 50 has a base 51 having a rectangularparallelepiped and made of a metal core material of copper alloy havinghigh thermal conductivity.

There is formed a cylindrical projection 51 a on the base 51 at acorner. On the projection, a terminal portion 51 b is provided as aterminal electrode. The wire plate 22 is recessed for the projection 51a. The height of the terminal portion 51 b is equal to that of theterminal portion 23 a, 23 b.

An LED element 52 has an anode 52 a on the upper surface thereof and acathode 52 b on the underside. The anode 52 a is connected to theterminal portion 23 a by the wire 26 a and the cathode 52 b iselectrically connected to the terminal portion 51 b of the projection 51a through the base 51.

When the driving voltage is applied to the LED element 52 from terminalportions 23 a and 51 b, the LED element 52 is driven to consume thepower to generate energy. A part of the energy becomes light, and alarge part of the energy becomes heat which is discharged from the LEDelement. The heat of the LED element is effectively transmitted to thebase 51 to cool the LED element 52.

In accordance with the fourth embodiment, the base 51 is used as a leadmember. Therefore, the LED element having electrodes on the uppersurface and underside can be used.

FIG. 7 is a sectional view of an LED according to a fifth embodiment ofthe present invention.

The same parts as the first embodiment are identified by the samereference numerals as those of FIGS. 1 and 2.

The LED device 60 comprises the high luminance LED element 25 of thefirst embodiment, a print substrate 61 as a substrate, and a heatradiation member 62 having thermal conductivity.

The print substrate 61 has conductive patterns 61 a of copper foil onthe underside thereof and a perforated hole 61 b having a circularshape. The encapsulating member 27 is projected from the hole 61 b anddischarges the light emitted from the LED element 25 as discharge light63. The conductive patterns 61 a are electrically and mechanicallyconnected to the terminal portions 23 a, 23 b, 24 a and 24 b withsolders 61 c. The heat radiation member 62 is secured to the heatradiation surface 21 a of the base 21 to be thermally connected thereto.

When the driving voltage is applied to the terminal portions 23 a, 23 b,24 a and 24 b through the conductive patterns 61 a to supply drivingcurrent to the LED element 25, the LED element 25 is driven to emitlight. The light is discharged as the discharge light 63 passing throughthe encapsulating member 27. Heat discharged from the LED element iseffectively transmitted to the base 21 and to the heat radiation member62.

In accordance with the fifth embodiment, the heat discharged from theLED element 25 is effectively transmitted to the heat radiation member62 through the base 21 to radiate the heat to the atmosphere. Thus, theheat rise in the LED element is held to a minimum limit. Consequently,it is possible to provide an LED withstanding large current driving toemit high luminance light. Further, by virtue of the heat radiationeffect, the deterioration of junctions in the LED element and luminancedecrease caused by color change of the encapsulating member 27 due tohigh heat can be prevented, thereby realizing an LED having a highreliability and a long life.

The print substrate 61 connected to the terminal portions 23 a, 23 b, 24a and 24 b is disposed apart from the heat radiation surface 21 a of thebase 21. Consequently, the print substrate 61 is not necessary to haveheat radiation role, and hence it is not necessary to make the substratewith expensive material having high thermal conductivity such as metalcore. Thus, it is possible to freely select a cheap material such asglass epoxy resin.

In order to increase the heat radiation effect of the heat radiationmember 62, it is preferable to increase area of the member or to form aplurality of projections on surfaces of the member. Although the LED 20of the first embodiment is used in the fifth embodiment, another LED ofany embodiment may be used. In the case using the second embodiment,since the base 31 has a high heat radiation effect, the heat radiationmember 62 is not necessary to be used.

FIG. 8 is a perspective view showing a sixth embodiment of the presentinvention. The same parts as the third embodiment shown in FIG. 4 areidentified with the same reference numerals. An LED device 70 comprisesthe high luminance LED 40 of the third embodiment, a pair of heat pipes71 as a thermal conductive member and a heat radiation plate 72 made ofmaterial having thermal conductivity. In the heat pipe 71, a liquidhaving thermal conductivity is charged.

An end of each heat pipe 71 is inserted in the heat radiation hole 41 aof the base 41, and the other end of the heat pipe 71 is secured to theheat radiation plate 72 so that the base 41 is thermally connected tothe heat radiation plate 72.

When the driving voltage is applied to the LED element 25, the LEDelement 25 is driven to emit light. The light is discharged as dischargelight. Heat discharged from the LED element is effectively transmittedto the base 41 and to the heat radiation plate 72 passing through theheat pipes 71.

In accordance with the sixth embodiment, the LED element 25 is mountedon the base 41 having thermal conductivity to be thermally connected,the base 41 is thermally connected to heat pipes 71, the heat pipes arethermally connected to the heat radiation plate 72. The heat radiationplate 72 effectively radiates the transmitted heat to the atmosphere.Thus, the heat rise in the LED element is held to a minimum limit.Consequently, it is possible to provide an LED device withstanding largecurrent driving to emit high luminance light.

Since the light emitting element 40 and the heat radiation plate 72 canbe separated from each other by the heat pipes 71, it is possible toprovide an LED device which is easily assembled in a system.

As the fifth embodiment, a print substrate (not shown) is not necessaryto have heat radiation role, and hence it is not necessary to make thesubstrate with expensive material having high thermal conductivity suchas metal core.

In order to increase the heat radiation effect of the heat radiationplate 72, it is preferable to change the shape of the plate, and thenumber of the heat pipes 71 may be increased. The base 41 and the heatpipes 71 may be connected by adhesives having thermal conductivity.

FIG. 9 is a side view showing a seventh embodiment of the presentinvention. The same parts as the first embodiment are identified withthe same reference numerals. The LED device 80 includes at least twolight emitting diodes and a flexible circuit board Each of the lightemitting diodes includes a base 51 made of a metal material and having aheat conducting property, a wire plate made of insulating material andhaving a hole, and being secured to an upper surface of the base,electric conductive patterns provided on the wire plate 22, and at leastone light emitting diode element 52 secured to the base within the holeof the wire plate, with the light emitting diode element 52 beingelectrically connected to the electric conductive patterns of the wireplate. The flexible circuit board includes at least two holes andelectric conductive patterns which are electrically connected to theelectric conductive patterns of the wire plate in each of the lightemitting diodes, and disposed on the light emitting diodes for lightbeing emitted from each of the light emitting diodes through each of theholes of the flexible circuit board.

The LED device 80 may further comprise a heat-radiating member disposedin contact with each base of the light emitting diodes. Each base of thelight emitting diodes may be buried in the heat-radiating member formore effective heat release from each of the light emitting diodes tothe beat-radiating member. Also, the heat-radiating member has a curvingline which has a same curvature as that of the flexible circuit board.

An LED device 80 comprises a plurality of high luminance LEDs 20 of thefirst embodiment, a flexible print substrate 81 and an arcuated heatradiating member 82.

The flexible print substrate 81 has three perforated holes 81 a, 81 band 81 c in which encapsulating members 27 of the LEDs 20 are inserted.Conductive patterns on the print substrate 81 are connected to terminalportions of the LEDs 20 by solders 83. The heat radiation member 82 hasthree recesses 82 a, 82 b and 82 c, in each of which the base 21 of theLEDs 20 is inserted and secured thereto to be thermally connectedthereto.

When driving current is supplied to the high luminance LEDs 20 throughthe print substrate 81, the LED elements 25 emit lights 84 a, 84 b and84 c. Heats discharged from the LED elements 25 are transmitted to theheat radiation member 82 through the bases 21 to be radiated.

In accordance with the seventh embodiment, the bases 21 of the LEDelements 25 are mounted on the heat radiation member 82 to be thermallyconnected. The heat radiation member 82 effectively radiates thetransmitted heat to the atmosphere. Thus, the heat rise in the LEDelement is held to a minimum limit. Consequently, it is possible toprovide an LED device withstanding large current driving to emit highluminance light.

As the fifth embodiment, a print substrate 81 is not necessary to haveheat radiation role.

In the LED device 80, a plurality of high luminance LEDs 20 areprovided. Therefore, for example, when high luminance LED elements ofred, yellow and green are disposed, it is possible to provide an LEDdevice for emitting lights of various colors.

Since high luminance LEDs 20 are mounted on the flexible heat radiationmember 82, discharge lights can be concentrated as shown in FIG. 9, ordiffused by bending the heat radiation member 82 into a convex shape.

Hereinafter, a method for manufacturing a plurality of high luminanceLEDs at the same time will be described with reference to FIGS. 10-15.

FIG. 10 is a perspective view showing a wire plate aggregation 90 and abase aggregation 91. The wire plate aggregation 90 is made of aninsulating material and has four divisions. In each division, aconductive pattern 91 a is formed by etching of copper and a mountinghole 90 b is formed. The base aggregation 91 is made of a metal corehaving thermal conductivity.

FIG. 11 is a perspective view showing a combination step of the wireplate aggregation 90 and the base aggregation 91. The wire plateaggregation 90 is secured to the surface of the base aggregation 91 byan adhesive to form a wire-plate-combined base aggregation 92.

FIG. 12 is a perspective view showing a mounting step of an LED element.An LED element 93 is mounted on the wire-plate-combined base aggregation92 at an exposed portion in the mounting hole 90 b and secured theretoby a silver paste.

FIG. 13 is a perspective view showing a wire bonding step. Theelectrodes of the LED element 93 are connected to the conductivepatterns 90 a by four wires 94.

FIG. 14 is a perspective view showing an encapsulating step. The LEDelement 93 in each division and wires 94 are encapsulated by anencapsulating member 95 of a transparent resin. Thus, each of the LEDsis completed on the wire-plate-combined base aggregation 92.

The wire-plate-combined base aggregation 92 is diced at boundariesbetween divisions as shown in FIG. 16 so that a single LED 96 iscompleted.

Thus, in accordance with the present invention, a large number of LEDscan be manufactured at the same time at a low cost.

If light scattering agents, fluorescent substances or beam attenuatingagents are included in the encapsulating member 27, various highluminance LEDs and devices which are different in directivity andwavelength of the discharge light can be provided.

In accordance with the present invention, the LED element is mounted onthe base having high thermal conductivity. Therefore, the heat generatedin the LED element is effectively conducted to the base, so that a highluminance LED having excellent heat radiation effects can be provided.

While the invention has been described in conjunction with preferredspecific embodiment thereof, it will be understood that this descriptionis intended to illustrate and not limit the scope of the invention,which is defined by the following claims.

1. A light emitting element comprising: a base made of heat conductivematerial and having a heat radiation surface formed on a surfacethereof; at least one wire plate made of an insulation material andsecured to an upper surface of the base; exposing means for forming anexposed mounting area on the surface of the base; conductive patternsformed on the wire plate; a light emitting chip secured to the base atthe mounting area; and connecting means for electrically connecting thelight emitting chip to the conductive patterns. 2-15. (canceled)
 16. Alight emitting diode device comprising: at least two light emittingdiodes, each of which comprising; a base having a heat conductingproperty, a wire plate made of insulating material, having a hole, andsecured to an upper surface of the base, electric conductive patternsprovided on the wire plate, at least one light emitting diode elementsecured to the base within the hole of the wire plate and electricallyconnected to the electric conductive patterns of the wire plate, and aflexible circuit board including at least two holes and electricconductive patterns which are electrically connected to the electricconductive patterns of the wire plate in each of the light emittingdiodes, and disposed on the light emitting diodes for light beingemitted from each of the light emitting diodes through each of the holesof the flexible circuit board.
 17. The light emitting diode deviceaccording to claim 16, further comprising a heat-radiating memberdisposed in contact with each base of the light emitting diodes.
 18. Thelight emitting diode device according to claim 17, each base of thelight emitting diodes being buried in the heat-radiating member.
 19. Thelight emitting diode device according to claim 17, wherein theheat-radiating member has a curving line.
 20. The light emitting diodedevice according to claim 17, wherein the heat-radiating member has acurving line which has a same curvature as that of the flexible circuitboard.